| Family |
AMD Mobile Sempron |
| Model number |
2100+ |
| CPU part numbers |
- SMF2100HAX3DQ is a part number on the chip
- SMF2100HAX3DQE is an orderable part number
|
| Stepping codes |
ABBBG NBBBG |
| Frequency |
2100+ (rated)
1000 MHz (real) |
| Clock multiplier |
5 |
| Package |
638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| AMD Package number |
29832 |
| Socket |
Socket S1 (S1g1) |
| Weight |
0.2oz / 6.7g |
| Architecture / Microarchitecture |
| Microarchitecture |
K8 |
| Core stepping |
DH-G2 |
| CPUID |
60FC2 |
| Manufacturing process |
0.065 micron |
| Data width |
64 bit |
| The number of CPU cores |
1 |
| The number of threads |
1 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
64 KB 2-way set associative instruction cache
64 KB 2-way set associative data cache |
| Level 2 cache size |
256 KB 16-way set associative cache |
| Multiprocessing |
Uniprocessor |
| Extensions and Technologies |
- MMX instructions
- Extensions to MMX
- 3DNow! technology
- Extensions to 3DNow!
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- AMD64 / AMD 64-bit technology
|
| Security Features |
- EVP / Enhanced Virus Protection
|
| Integrated peripherals / components |
| Integrated graphics |
None |
| Memory controller |
The number of controllers: 1
Memory channels: 2
Supported memory: DDR2 |
| Other peripherals |
- One 16-bit HyperTransport link with speeds up to 800 MHz
|
| Electrical / Thermal parameters |
| Maximum operating temperature |
95°C |
| Thermal Design Power |
8 Watt |
